[情報] 18吋晶圓製造在規格上面臨的挑戰:－線上遊戲排行榜2013/2014,進擊的巨人線上看,candy crush saga外掛,正妹寫真三圍

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[情報] 18吋晶圓製造在規格上面臨的挑戰

Oct 3rd 2013, 11:07, by weiwei77

作者weiwei77 (Weiwei)

看板Tech_Job

標題[情報] 18吋晶圓製造在規格上面臨的挑戰

時間Thu Oct 3 11:07:41 2013

如果消息是真的，TSMC的股票又要漲了吧 XD 在9月份剛過去的台灣國際半導體展(SEMICON Taiwan)，18吋晶圓製造與3D IC一樣，都是展會中的熱門議題；其實，兩者所面對的挑戰也很類似，包括：有相當高的投資門檻，需要投入龐大的資金；許多業界標準尚未建立；及現階段良率不佳等。比較不一樣的是，18吋晶圓是依據摩爾定律(Moore’s Law) (註)發展的必然結果，但 3D IC的趨勢卻是因市場及技術導向而逐漸成形的。說到18吋晶圓製程的關鍵性發展，http://ppt.cc/Cfl9 -- ※ 發信站: 批踢踢實業坊(ptt.cc) ◆ From: 223.140.201.56

→ jamison0814:so what?這裡是stock板嗎? 10/03 11:18

→ AQUANGEL:什麼消息是真的? 10/03 11:32

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